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The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages formatIsbn:Softcover - 9781461372769 alte Briefe und Nachrichten von D-79111 Freiburg formatIsbn:Softcover - 9789400737297 at the University of 9781489915481

SKU: 49233232179
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The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages formatIsbn:Softcover 9781461372769 alte Briefe und Nachrichten von D 79111 Freiburg formatIsbn:Softcover 9789400737297 at the University of 9781489915481 alte Briefe und Nachrichten von alten Büchern mit Anmerkungen Erstes Stück 1Die Vertrauensbeziehung als Prinzipal Agenten Beziehung18

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